What is potting in electronics?

Potting is a process used in electronics to encapsulate components with a protective material. This practice is crucial for enhancing the durability and reliability of electronic devices, particularly in harsh environments.

Which potting material should be used for electronic devices?

Environmental Conditions The operating environment of the electronic device considerably influences the choice of potting material. Materials with specific resistances, such as silicone or epoxy, may be required for devices exposed to extreme temperatures, high humidity, or harsh chemicals.

Why is potting used in encapsulation?

Potting has also been used to protect against reverse engineering or to protect parts of cryptography processing cards. When such materials are used only on single components instead of entire assemblies, the process is referred to as encapsulation.

What type of adhesive is best for electronic components?

Silicones combine flexibility with excellent high-temperature resistance. Acrylics resist vibrations and thermal cycling, and polyurethanes provide strong and flexible bonds. Curing for electronic component adhesives occurs with light, heat, at room temperature, or in a dual curing process.

What are electronic component adhesives?

As their name suggests, these products are designed to bond electronic components, discrete devices that are used to build electronic circuits, to substrates. Typically, electronic component adhesives are used for surface-mounting parts to printed circuit boards (PCBs).

What type of potting compound can be used on a circuit board?

Conformal coatings can be applied as liquid or condensed from a vapor phase. When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used.