Why do IGBT modules fail?

In an IGBT module, high electrical currents passing through the bond wires and metallisation layers can cause the movement of metal atoms due to electro-migration. Table 5. IGBT modules’ failure mechanisms. Excluding the early failures due to manufactur-ing and installation defects, the failure mecha-nisms are summarised in Table 5.

Why is my IGBT converter not working?

Insufficient protection of the converter hard-ware against the environment, particularly in humid environment, leads to the build-up of salt traces and other conductive deposits on IGBT module casing and gate driver boards. They may cause flashovers and improper operation of gate driver that the device is not designed to handle.

Why does my IGBT not generate a 300V Spike?

Normally, car ignitions won't generate much more than a 300V spike and to demonstrate this here's another picture taken from this site: - That site also explains something else which may have resulted in the failure of the IGBT. Dwell angle is the time period that the contacts are closed before opening to "generate" the spark.

What happens if IGBT is closed at low speed?

At low speed, the points will close, the IGBT will conduct, the capacitor will become fully charged, and much of the voltage will be dropped across the resistor. This means that the voltage across the coil and current in the coil primary will be low, resulting in less spark (delta current) as the points/IGBT open.

What is thermomechanical creep in an IGBT module?

Thermomechanical creep in an IGBT module is associated with prolonged exposure to increased temperatures during operation. The constant application of high temperatures can induce slow, time-de-pendent deformation in the materials, particu-larly in solder joints and other critical compo-nents.

Why do IGBT chips fail?

Under the action of overcurrent stress which can lead to energy shock, hot spots are formed locally in the IGBT package’s components. When the local temper-ature is too high, it can damage the chip and other package components such as bond wires, ultimately resulting in device failure. Figure 2